red-,再，重新，flow,流动。比喻用法。

1. After reflow, carefully remove substrate with components and allow to cool.

回流后, 仔细拿开带组件的基板,并使之冷却.

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2. Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏.

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3. Compatible with infrared and vapor phase reflow solder process.

适用于回流焊接工艺.

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4. Good management for reflow and wave profile and profile board.

良好的管理为回流焊和波峰焊温度曲线及温度曲线量测板.

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5. The reflow process relies on the temperature profile setting.

回流过程依赖于温度曲线的设定.

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